Hi,
For customers to benchmark max power consumption hands-on for C66x devices (to plan for cooling HW), please advice what DSPLIB math function that could generate the most heat when run from L2RAM?
The DSPLIB in MCSDKv3 comes with a single FFT example where some studies in the simulator reveils the following stats for 'core efficiency':
/* Call the FFT routines */
DSP_fft16x16(w_16x16, N, x_16x16, y_16x16); // cycle.CPU=778 CPU.stall.summary=286 Load=73%
DSP_fft16x32(w_16x32, N, x_16x32, y_16x32); // cycle.CPU=1514 CPU.stall.summary=439 Load=77%
DSP_fft32x32(w_32x32, N, x_32x32, y_32x32); // cycle.CPU=1493 CPU.stall.summary=602 Load=71%
Q1 - Are there any better algorithms that for instance uses more of the .M units in parallel than the one above?
Q2 - Will the 32x32 generate more heat (.M unit works harder?) than the 16x32 even if it shows more stalls?
Grateful for your advice.
/Magnus